Leadless plastic chip carrier with etch back pad singulation
US6933594B2 · kind B2 · utility
96Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2001 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Sep 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.