Semiconductor device with improved heatsink structure
US6933612B2 · kind B2 · utility
5Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2003 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Oct 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device for an improved heatsink structure. The semiconductor device is composed of a first substrate, a first heatsink plate connected to the first substrate, a second substrate having a rear surfaces connected to the first heatsink plate, a semiconductor chip having a main surface bonded to a main surface of the second substrate, and a second heatsink plate connected to a rear surface of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.