Reflow soldering method
US6935553B2 · kind B2 · utility
20Cited by
23References
23Claims
0Family size
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Inventors
Key dates
| Filing date | Apr 15, 2003 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/087
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.