Tadatomo Suga
43Patents
10h-index
37Co-inventors
75Inventor score
Filing activity: Apr 13, 2000 → Oct 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6465892B1 | Interconnect structure for stacked semiconductor device | Electricity | 533 | Expired |
| US6472293B2 | Method for manufacturing an interconnect structure for stacked semiconductor device | Electricity | 316 | Expired |
| US7078811B2 | Semiconductor device and method for fabricating the device | Electricity | 142 | Expired |
| US7183190B2 | Semiconductor device and fabrication method therefor | Electricity | 22 | Expired |
| US6935553B2 | Reflow soldering method | Electricity | 20 | Expired |
| US9142532B2 | Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer | Electricity | 20 | Active |
| US6887319B2 | Residue-free solder paste | Electricity | 15 | Expired |
| US7217631B2 | Semiconductor device and method for fabricating the device | Electricity | 12 | Expired |
| US7550366B2 | Method for bonding substrates and device for bonding substrates | Electricity | 12 | Expired |
| US7268430B2 | Semiconductor device and process for manufacturing the same | Electricity | 11 | Expired |
| US7686912B2 | Method for bonding substrates and method for irradiating particle beam to be utilized therefor | Performing Operations; Transporting | 10 | Active |
| US7262613B2 | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | Physics | 8 | Expired |
| US7784670B2 | Joining method and device produced by this method and joining unit | Electricity | 7 | Active |
| US6777967B2 | Inspection method and inspection apparatus | Physics | 7 | Expired |
| US8091764B2 | Joining method and device produced by this method and joining unit | Electricity | 7 | Active |
| US9601350B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Electricity | 6 | Active |
| US6975489B2 | Circuit structure and semiconductor integrated circuit | Electricity | 6 | Expired |
| US7301243B2 | High-reliable semiconductor device using hermetic sealing of electrodes | Electricity | 4 | Expired |
| US9870922B2 | Substrate bonding apparatus and substrate bonding method | Electricity | 4 | Active |
| US7976814B2 | Fullerene derivative fine wire and its manufacturing method | Chemistry; Metallurgy | 2 | Active |
| US7100279B2 | Method of mounting an electronic part | Emerging Cross-Sectional Technologies | 2 | Expired |
| US10166749B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Emerging Cross-Sectional Technologies | 2 | Active |
| US7061259B2 | Inspection method and inspection apparatus | Physics | 2 | Expired |
| US8246926B2 | Fullerene hollow structure needle crystal and C60-C70 mixed fine wire, and method for preparation thereof | Chemistry; Metallurgy | 1 | Active |
| US7776735B2 | Semiconductor device and process for manufacturing the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.