Optoelectronic package and fabrication method

US6935792B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Richard Joseph Saia · Niskayuna, US
• Thomas Bert Gorczyca · Schenectady, US
• Christopher James Kapusta · Duanesburg, US
• Ernest Wayne Balch · Malta, US
• Glenn Scott Claydon · Wynantskill, US
• Samhita Dasgupta · Niskayuna, US
• Eladio Clemente Delgado · Burnt Hills, US

Key dates

• Filing date: Oct 21, 2002
• Grant date: Aug 30, 2005
• Expiry date: Sep 27, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15192
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.