Planarity detection methods and apparatus for electrochemical mechanical processing systems
US6936154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2001 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Mar 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The methods and systems described provide for an in-situ detection of planarity of a layer that is deposited on or etched off the surface of a substrate. Planarity can be detected using various detection mechanisms, including optical, electrical, mechanical and acoustical, in combination with the electrochemical mechanical processing methods, including electrochemical mechanical deposition and electrochemical mechanical etching. Once planarity is detected, a planarity signal can be used to terminate or alter a process that has been previously initiated, or begin a new process. In a preferred embodiment, an optical detection system is used to detect planarity during the formation of planar conductive layers obtained by electrochemical mechanical processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.