MEMS device with conductive path through substrate
US6936918B2 · kind B2 · utility
62Cited by
28References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2004 |
| Grant date | Aug 30, 2005 |
| Priority date | — |
| Expiry date | Apr 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.