Bruce Wachtmann
6Patents
3h-index
8Co-inventors
39Inventor score
Filing activity: Jan 11, 2002 → Apr 19, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6936918B2 | MEMS device with conductive path through substrate | Electricity | 62 | Expired |
| US7034393B2 | Semiconductor assembly with conductive rim and method of producing the same | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6964894B2 | Apparatus and method of forming a device layer | Performing Operations; Transporting | 8 | Expired |
| US7906359B2 | Method of forming a surface micromachined MEMS device | Physics | 2 | Active |
| US6956274B2 | TiW platinum interconnect and method of making the same | Performing Operations; Transporting | 0 | Expired |
| US6878626B1 | TiW platinum interconnect and method of making the same | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.