Miniaturized image sensor module
US6939456B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Oct 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/40
Abstract
A miniaturized image sensor module including a substrate, a photosensitive chip, a transparent layer, an injection molded structure, and a lens barrel. The substrate has an upper surface, a lower surface and a slot. The chip is electrically connected to the lower surface of the substrate with a photosensitive region of the chip exposed from the slot. The transparent layer is arranged on the upper surface of the substrate to cover over the slot. The injection molded structure encapsulates and packages the substrate and the chip and is formed with a frame layer on a top of the transparent layer. The frame layer is formed with an internal thread and the lens barrel is formed with an external thread to be screwed to the internal thread. The lens barrel is formed with a chamber and an opening communicating with the chamber. An aspheric lens is also arranged within the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.