Apparatus for manufacturing semiconductor devices with a moveable shield
US6939807B2 · kind B2 · utility
17Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Aug 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing semiconductor devices includes a supporter portion on which a semiconductor substrate is placed, a nozzle portion for injecting a fluid to an edge of the substrate placed on the supporter portion, a shielding cover for preventing the fluid injected from the nozzle portion from flowing to a shielding portion among a pattern-formed portion, and a shielding cover moving portion device for moving the shielding cover up and down. The apparatus makes it possible to prevent a chemical solution injected to the edge of a wafer from flowing to a shielding portion of the wafer when the wafer edge is etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.