Injection molded image sensor module
US6940058B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Sep 6, 2005 |
| Priority date | — |
| Expiry date | Oct 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
An injection molded image sensor module includes an image sensor, an injection molded body for sealing the image sensor, a lens barrel and an aspheric lens. The image sensor includes a substrate, a frame layer on the substrate, a photosensitive chip electrically connected to the substrate, and a transparent layer placed on a top of the frame layer so that the photosensitive chip may receive optical signals passing through the transparent layer. The injection molded body has a first end face, a second end face, a hole and an internal thread formed in the hole so that the image sensor may receive the optical signals passing through the hole. The lens barrel has an external thread, a chamber and a transparent region. The external thread is screwed to the hole of the injection molded body. The aspheric lens is arranged within the chamber and under the transparent region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.