No-flow underfill process and material therefor
US6943058B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A no-flow underfill material and process suitable for underfilling a bumped circuit component. The underfill material initially comprises a dielectric polymer material in which is dispersed a precursor capable of reacting to form an inorganic filler. The underfill process generally entails dispensing the underfill material over terminals on a substrate, and then placing the component on the substrate so that the underfill material is penetrated by the bumps on the component and the bumps contact the terminals on the substrate. The bumps are then reflowed to form solid electrical interconnects that are encapsulated by the resulting underfill layer. The precursor may be reacted to form the inorganic filler either during or after reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.