Derek B. Workman
9Patents
4h-index
15Co-inventors
46Inventor score
Filing activity: Sep 10, 2001 → Nov 7, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6660560B2 | No-flow underfill material and underfill method for flip chip devices | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6943058B2 | No-flow underfill process and material therefor | Electricity | 20 | Expired |
| US7331106B2 | Underfill method | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7119449B2 | Enhancement of underfill physical properties by the addition of thermotropic cellulose | Electricity | 4 | Expired |
| US7790814B2 | Radiopaque polymers for circuit board assembly | Emerging Cross-Sectional Technologies | 3 | Active |
| US7498197B2 | Silica nanoparticles thermoset resin compositions | Electricity | 1 | Active |
| US7202571B2 | Electronic module with form in-place pedestal | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7754824B2 | Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator | Chemistry; Metallurgy | 0 | Active |
| US7205652B2 | Electronic assembly including multiple substrates | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.