Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film
US6943442B2 · kind B2 · utility
24Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Sep 13, 2005 |
| Priority date | — |
| Expiry date | Feb 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09509
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are included a wiring substrate including a predetermined wiring pattern, an electronic parts connection terminal on an element forming surface of which is flip-chip connected to the wiring pattern, an insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the electronic parts and the insulating film on the connection terminal, and an overlying wiring pattern formed on the insulating film and connected to the connection terminal via the via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.