Integrated circuit redistribution package
US6945791B2 · kind B2 · utility
5Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Feb 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a redistribution package having an upper surface that includes contacts with reduced pitch that correspond, for example, to that of a Controlled Collapse Chip Connection (“C4”) structure formed on a chip, and a lower surface having contacts with increased pitch that correspond, for example, to a printed circuit board employing ball grid array (“BGA”) pads. A series of power, signal and ground conductors extend through the body of the redistribution package and interconnect the circuit board contacts to the chip contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.