Patent · US Expired

Light emitting semiconductor method and device

US6946685B1 · kind B1 · utility

25Cited by
19References
35Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 2000
Grant dateSep 20, 2005
Priority date
Expiry dateOct 24, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/825

Abstract

Silver electrode metallization in light emitting devices is subject to electrochemical migration in the presence of moisture and an electric field. Electrochemical migration of the silver metallization to the pn junction of the device results in an alternate shunt path across the junction, which degrades efficiency of the device. In accordance with a form of this invention, a migration barrier is provided for preventing migration of metal from at least one of the electrodes onto the surface of the semiconductor layer with which the electrode is in contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.