Edge normal process
US6947588B2 · kind B2 · utility
15Cited by
29References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2004 |
| Grant date | Sep 20, 2005 |
| Priority date | — |
| Expiry date | Jul 14, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.