Method of depositing material into high aspect ratio features
US6948231B2 · kind B2 · utility
3Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2002 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Dec 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.