Son V. Nguyen
272Patents
29h-index
275Co-inventors
93Inventor score
Filing activity: Aug 26, 1985 → Sep 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8252051B2 | Method of implanting a prosthetic valve in a mitral valve with pulmonary vein anchoring | Human Necessities | 649 | Active |
| US7993394B2 | Low profile transcatheter heart valve | Emerging Cross-Sectional Technologies | 620 | Active |
| US7088003B2 | Structures and methods for integration of ultralow-k dielectrics with improved reliability | Emerging Cross-Sectional Technologies | 531 | Expired |
| US7049247B2 | Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made | Electricity | 521 | Expired |
| US8454685B2 | Low profile transcatheter heart valve | Emerging Cross-Sectional Technologies | 364 | Active |
| US5563105A | PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element | Electricity | 303 | Expired |
| US5536360A | Method for etching boron nitride | Emerging Cross-Sectional Technologies | 236 | Expired |
| US8546956B2 | Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding | Electricity | 210 | Active |
| US8568475B2 | Spiraled commissure attachment for prosthetic valve | Human Necessities | 200 | Active |
| US9393110B2 | Prosthetic heart valve | Human Necessities | 192 | Active |
| US9241792B2 | Two-step heart valve implantation | Human Necessities | 142 | Active |
| US10418277B2 | Air gap spacer formation for nano-scale semiconductor devices | Electricity | 136 | Active |
| US5468687A | Method of making TA.sub.2 O.sub.5 thin film by low temperature ozone plasma annealing (oxidation) | Electricity | 91 | Expired |
| US9349687B1 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Electricity | 74 | Active |
| US7282458B2 | Low K and ultra low K SiCOH dielectric films and methods to form the same | Electricity | 63 | Expired |
| US5412246A | Low temperature plasma oxidation process | Emerging Cross-Sectional Technologies | 61 | Expired |
| US6378221B1 | Systems and methods for mapping and marking the thickness of bioprosthetic sheet | Human Necessities | 59 | Expired |
| US6483172B1 | Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states | Electricity | 57 | Expired |
| US6553681B2 | Methods for measuring a bio-material for use in an implant | Human Necessities | 51 | Expired |
| US7491658B2 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5753948A | Advanced damascene planar stack capacitor fabrication method | Electricity | 44 | Expired |
| US5773362A | Method of manufacturing an integrated ULSI heatsink | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5770469A | Method for forming semiconductor structure using modulation doped silicate glasses | Emerging Cross-Sectional Technologies | 42 | Expired |
| US9636223B2 | Systems and methods for placing a coapting member between valvular leaflets | Human Necessities | 41 | Active |
| US7381659B2 | Method for reducing film stress for SiCOH low-k dielectric materials | Electricity | 40 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.