System and method for multi-stage process control in film removal
US6949007B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2004 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Aug 31, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fabricating system. A processing tool executes a film removal process on a wafer using a chemical mechanism. A metrology tool monitors surface characteristics of the wafer to obtain a measured film thickness thereof before and after a first removal process, wherein the first removal process lasts a first processing duration. The controller, coupled to the processing and metrology tools, determines whether the difference between the measured film thickness and a preset film thickness exceeds a preset value, and determines a second processing duration of a second removal process according to the measured and preset film thickness and the first processing duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.