Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
US6949816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2003 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A90/10
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.