Printed circuit board multi-layer structure with embedded device
US6949836B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 12, 2003 |
| Grant date | Sep 27, 2005 |
| Priority date | — |
| Expiry date | Jun 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a printed circuit board which is capable of air-tightly sealing a functional surface of a device and of preventing excessive stress from acting on the device itself or a conductive bump conjugating the device with a wiring board and a method of fabricating the printed circuit board. The printed circuit board has a device mounted in a hollow formed in a wiring board via a plurality of conductive bumps. In the printed circuit board, a gap is formed between a functional surface of the device and an inner surface of the hollow, and a sealing member is disposed around side surfaces of the device so as to air-tightly isolate the gap and a space within the hollow excepting the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.