Yoichi Oya
5Patents
3h-index
3Co-inventors
42Inventor score
Filing activity: Apr 14, 1999 → Jun 23, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6469393B2 | Semiconductor package and mount board | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6797890B2 | High frequency module device and method for its preparation | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6714422B2 | High frequency module device and method for its preparation | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6949836B2 | Printed circuit board multi-layer structure with embedded device | Electricity | 2 | Expired |
| US7192801B2 | Printed circuit board and fabrication method thereof | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.