Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
US6951510B1 · kind B1 · utility
14Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2004 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Mar 12, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.