Patent · US Expired

Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method

US6951824B2 · kind B2 · utility

37Cited by
3References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 28, 2000
Grant dateOct 4, 2005
Priority date
Expiry dateDec 28, 2020

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01P2015/0814
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for manufacturing a micromechanical component, that has at least one hollow space and a functional element that is provided at least partially in the hollow space and/or a functional layer that is provided at least partially therein, and a micromechanical component that is manufactured in accordance with the method, are described. To reduce manufacturing costs, the functional element and/or the functional layer is provided with a first protective layer at least in an area that directly or indirectly borders on a first sacrificial layer, which temporarily occupies the space of the hollow space that is subsequently formed in one or a plurality of etching steps, the material of the first protective layer being selected such that at least one etching process and/or etching medium, which etches or dissolves the first sacrificial layer, either does not substantially attack the first protective layer or does so only at a reduced etching rate in comparison to the first sacrificial layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.