Method and apparatus for inspecting a semiconductor device
US6952492B2 · kind B2 · utility
43Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Aug 9, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/2251
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for inspecting a semiconductor device in which failure occurence conditions on a whole wafer are estimated by calculating the statistic of potential contrasts in pattern sections from sampled images to implement higher throughput, and defective conditions of a process are detected at an early stage with the help of time series data of the estimate result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.