Patent · US Expired

Soldering method for mounting electric components

US6953145B2 · kind B2 · utility

1Cited by

9References

17Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Kuno Wolf · Hechingen, DE
Alexander Wallrauch · Gomaringen, DE
Horst Meinders · Reutlingen, DE
Barbara Will · Herrenberg, DE
Peter Urbach · Gomaringen, DE

Key dates

Filing date	Jul 20, 2001
Grant date	Oct 11, 2005
Priority date	—
Expiry date	Jul 20, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.