Barbara Will
5Patents
1h-index
13Co-inventors
44Inventor score
Filing activity: Jul 20, 2001 → Jan 11, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6806173B1 | Method for producing highly doped semiconductor components | Electricity | 7 | Expired |
| US6518101B1 | Multi-layer diodes and method of producing same | Electricity | 1 | Expired |
| US8679975B2 | Method for forming trenches in a semiconductor component | Performing Operations; Transporting | 1 | Active |
| US6953145B2 | Soldering method for mounting electric components | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7199031B2 | Semiconductor system having a pn transition and method for manufacturing a semiconductor system | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.