Patent · US Expired

Method and device for assembling substrates

US6953514B2 · kind B2 · utility

2Cited by
7References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 13, 2001
Grant dateOct 11, 2005
Priority date
Expiry dateJan 24, 2022

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2429/02
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method and apparatus for joining at least two substrates together, especially to form an optical data carrier, are provided. Substrates are disposed in a spaced-apart manner between two plates that are disposed opposite from, and are movable relative to, one another. At least one of the plates is connected to a flexible membrane. At least the plate to which the flexible membrane is connected is moved in such a way that a pressure difference is produced on opposite sides of the membrane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.