Ring chuck to hold 200 and 300 mm wafer
US6954269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2003 |
| Grant date | Oct 11, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ring chuck that holds a wafer with a vacuum uses a vacuum trough that contacts the entire outer edge of the wafer. The chuck has a base having a top surface equal to or slightly smaller than a water to be tested with vacuum channels in the base. The base provides the mechanism to connect the chuck to a measurement instrument and a vacuum source. An annulus of non-contaminant material that has concentric rings extending upward from its outer edge is fixed to the base top surface with the trough between the concentric rings connected to the vacuum channels. The vacuum trough holds the wafer securely to the chuck and minimizes vibrations when the wafer is rotated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.