Production of laminates for printed wiring boards using protective carrier
US6955740B2 · kind B2 · utility
4Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2002 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Nov 4, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.