Patent · US Expired

Method for producing a substrate arrangement

US6955943B2 · kind B2 · utility

5Cited by

4References

16Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Elke Zakel · Falkensee, DE
Ghassem Azdasht · Berlin, DE

Key dates

Filing date	Jun 26, 2002
Grant date	Oct 18, 2005
Priority date	—
Expiry date	Jul 11, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method is provided for producing a substrate arrangement. The process includes the preparation of a substrate and bringing connecting surfaces of the substrate into contact with inner contacts of a wiring layer, the application of contact material to outer contacts of the wiring layer defining an outer connecting surface arrangement to form base contact bumps (31) and the application of joining material to the base contact bumps to form contact bump tops joined to the base contact bumps, wherein the joining material is applied as joining material moldings (35) and the contact bump tops are formed by at least partial melting of the joining material moldings by the action of laser energy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.