Patent · US Expired

Yield maximization in the manufacture of integrated circuits

US6957402B2 · kind B2 · utility

195Cited by
3References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 24, 2003
Grant dateOct 18, 2005
Priority date
Expiry dateNov 26, 2023

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F30/30
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A method and apparatus for improving the manufacturability of Integrated Circuits (ICs) formed on semiconductor dies is described. A plurality of different designs for some or all of the standard cells are made available to the circuit designer. Each different design may address a different problem associated with different manufacturing processes or a different design related yield limiter. Each of the design variants is characterized indicating its relative ease of manufacture, or it's yield sensitivity to certain IC design factors. The designer, typically with assistance from computer aided tools, can then select the standard cell variant for each of the cell used in the IC design that best addresses his or her design constraints. In other embodiments, variant versions of I/O cells and memory cells could also be created and made available to the designer in a similar fashion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.