Compliant and hermetic solder seal
US6958446B2 · kind B2 · utility
1Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2002 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Feb 22, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12104
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.