Integrated circuit including active components and at least one passive component associated fabrication method
US6958505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2001 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/485
Abstract
There is provided an integrated circuit having active components including junctions formed in a monocrystalline substrate doped locally, and at least one passive component situated above the active components. The integrated circuit includes a first insulating layer separating the active components and abase of the passive component, and a metal terminal for electrically connecting the passive component with at least one of the active components. The metal terminal is formed in the thickness of the first insulating layer and has a contact surface that projects from the limits of a junction of the one active component. In a preferred embodiment, the passive component is a capacitor. Also provided is a method of fabricating an integrated circuit that includes MOS transistors and an onboard memory plane of DRAM cells in a matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.