Method to fabricate passive components using conductive polymer
US6958522B2 · kind B2 · utility
27Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2001 |
| Grant date | Oct 25, 2005 |
| Priority date | — |
| Expiry date | Oct 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.