Lawrence A. Clevenger
635Patents
25h-index
355Co-inventors
93Inventor score
Filing activity: Oct 29, 1993 → Aug 15, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8241992B2 | Method for air gap interconnect integration using photo-patternable low k material | Electricity | 401 | Active |
| US9837355B2 | Method for maximizing air gap in back end of the line interconnect through via landing modification | Electricity | 294 | Active |
| US6632741B1 | Self-trimming method on looped patterns | Electricity | 260 | Expired |
| US7397260B2 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Electricity | 167 | Expired |
| US6337513B1 | Chip packaging system and method using deposited diamond film | Emerging Cross-Sectional Technologies | 115 | Expired |
| US9660028B1 | Stacked transistors with different channel widths | Electricity | 69 | Active |
| US7052937B2 | Method and structure for providing improved thermal conduction for silicon semiconductor devices | Electricity | 56 | Expired |
| US5624869A | Method of forming a film for a multilayer Semiconductor device for improving thermal stability of cobalt silicide using platinum or nitrogen | Emerging Cross-Sectional Technologies | 56 | Expired |
| US6777761B2 | Semiconductor chip using both polysilicon and metal gate devices | Electricity | 54 | Expired |
| US6573565B2 | Method and structure for providing improved thermal conduction for silicon semiconductor devices | Electricity | 52 | Expired |
| US10535608B1 | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate | Electricity | 48 | Active |
| US5608266A | Thin film for a multilayer semiconductor device for improving thermal stability and a method thereof | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5828131A | Low temperature formation of low resistivity titanium silicide | Electricity | 44 | Expired |
| US7531407B2 | Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same | Electricity | 43 | Active |
| US6255712A | Semi-sacrificial diamond for air dielectric formation | Electricity | 40 | Expired |
| US5510295A | Method for lowering the phase transformation temperature of a metal silicide | Emerging Cross-Sectional Technologies | 37 | Expired |
| US7166913B2 | Heat dissipation for heat generating element of semiconductor device and related method | Electricity | 34 | Expired |
| US6720595B2 | Three-dimensional island pixel photo-sensor | Electricity | 33 | Expired |
| US6399447B1 | Method of producing dynamic random access memory (DRAM) cell with folded bitline vertical transistor | Electricity | 32 | Expired |
| US8024012B2 | Intelligent wireless power charging system | Electricity | 30 | Active |
| US6495445B2 | Semi-sacrificial diamond for air dielectric formation | Physics | 29 | Expired |
| US7041525B2 | Three-dimensional island pixel photo-sensor | Electricity | 29 | Expired |
| US6958522B2 | Method to fabricate passive components using conductive polymer | Electricity | 27 | Expired |
| US7514271B2 | Method of forming high density planar magnetic domain wall memory | Emerging Cross-Sectional Technologies | 26 | Active |
| US7657995B2 | Method of fabricating a microelectromechanical system (MEMS) switch | Emerging Cross-Sectional Technologies | 25 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.