Patent · US Expired

Electromechanical module, for holding IC-chips in a chip testing system, that synchronizes and translates test signals to the IC-chips

US6958617B1 · kind B1 · utility

6Cited by
2References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 16, 2004
Grant dateOct 25, 2005
Priority date
Expiry dateFeb 25, 2024

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/31926
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An electromechanical module, for holding IC-chips in a chip testing system, includes a circuit board having a plurality of sockets mounted thereon. Each socket is structured to hold one IC-chip that is to be tested, and each socket has a corresponding register on the circuit board. In addition, a bus is on the circuit board, which—a) sends a timing pulse to a clock input on all of the registers in parallel, and b) concurrently sends a clock signal and N−1 test signals to N data inputs on all of the registers. Further, each socket has N input terminals that are connected to N outputs on a respective set of signal translators on the circuit board, and each set of signal translators has N inputs that are connected to N data outputs on the socket's corresponding register.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.