Buildup substrate pad pre-solder bump manufacturing
US6960518B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Nov 1, 2005 |
| Priority date | — |
| Expiry date | Jul 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method is provided for the interconnection of flip chips to a supporting substrate. The invention starts with a conventional first substrate, that serves as a semiconductor device support structure, over the surface of which a first pattern of contacts points has been provided. The invention then uses a second substrate, for instance a glass or quartz plate, and creates over the surface thereof a second pattern of solder bumps separated by solder non-wettable surfaces. The second pattern is a mirror image of the first pattern. By then overlying the first pattern of contact points with the second pattern of solder bumps, a step of reflow can be applied to the solder bumps, transferring the solder bumps from the second substrate to the contact points provided over the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.