Method and apparatus used in fabrication of MEMS stacks
US6962514B2 · kind B2 · utility
2Cited by
10References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Aug 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are methods of fabricating three dimensional Micro-Electro-Mechanical-Systems (MEMS). This method involved stacking of silicon-containing components which are separated by spacers. The stacked components are precision aligned and then may be bonded, retained or fastened together to form a rigid structure. Spaces created between MEMS device components by the separations may be filled with an electrically isolating fluid such as a gas or vacuum. Also disclosed is a method of aligning components relative to each other and an alignment jig which may be used to align the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.