Semiconductor integrated circuit device
US6963136B2 · kind B2 · utility
121Cited by
9References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.