Fabricating complex micro-electromechanical systems using a flip bonding technique
US6964882B2 · kind B2 · utility
7Cited by
23References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Sep 27, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.