Device for thermally treating substrates
US6965093B2 · kind B2 · utility
2Cited by
6References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The aim of the invention is to enable substrates to be thermally treated in a more homogeneous manner. In order to achieve this, a device is provided for thermally treating substrates, especially semiconductor wafers, comprising at least two adjacent, essentially parallel heating elements which respectively have at least one heating wire. The two adjacent heating elements are embodied in such a way that they are quasi-complementary, at least in parts, in terms of the coiled and uncoiled segments of the heating wires pertaining thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.