Semiconductor package with exposed die pad and body-locking leadframe
US6965157B1 · kind B1 · utility
21Cited by
286References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2003 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Mar 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.