Method of reviewing detected defects
US6965429B2 · kind B2 · utility
4Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2002 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Aug 19, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.