Method of forming flow-fill structures
US6966810B2 · kind B2 · utility
0Cited by
15References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2003 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Feb 2, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A preferred embodiment of the invention is directed to support structures such as spacers used to provide a uniform distance between two layers of a device. In accordance with a preferred embodiment, the spacers may be formed utilizing flow-fill deposition of a wet film in the form of a precursor such as silicon dioxide. Formation of spacers in this manner provides a homogenous amorphous support structure that may be used to provide necessary spacing between layers of a device such as a flat panel display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.