Patent · US Expired

Module power distribution network

US6967398B2 · kind B2 · utility

12Cited by

7References

17Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Roland Frech · Esslingen am Neckar, DE
Bernd Garben · Schenefeld, DE
Erich Klink · Schenefeld, DE
Stefano Oggioni · Milano, IT

Key dates

Filing date	Feb 4, 2005
Grant date	Nov 22, 2005
Priority date	—
Expiry date	Feb 6, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10734
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, a plurality of electrically insulative layers, and a plurality of electrically conductive layers disposed between the insulative layers. The electrically conductive layers form staggered placements of at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between, and signal distribution layers comprising signal conductors. Vias form conductive paths through the insulative layers and conductive layers; the corresponding signal, voltage and ground distribution layers are electrically connected with each other and with the uppermost layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.