Stackable layers containing ball grid array packages
US6967411B2 · kind B2 · utility
12Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2003 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Feb 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.