Floyd K. Eide
9Patents
8h-index
2Co-inventors
59Inventor score
Filing activity: Nov 4, 1988 → Jul 9, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4956694A | Integrated circuit chip stacking | Electricity | 322 | Expired |
| US5612570A | Chip stack and method of making same | Electricity | 192 | Expired |
| US5313096A | IC chip package having chip attached to and wire bonded within an overlying substrate | Electricity | 146 | Expired |
| US6028352A | IC stack utilizing secondary leadframes | Electricity | 122 | Expired |
| US6014316A | IC stack utilizing BGA contacts | Electricity | 113 | Expired |
| US6195268A | Stacking layers containing enclosed IC chips | Electricity | 38 | Expired |
| US6967411B2 | Stackable layers containing ball grid array packages | Electricity | 12 | Expired |
| US7242082B2 | Stackable layer containing ball grid array package | Electricity | 9 | Expired |
| USRE43536E1 | Stackable layer containing ball grid array package | General | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.