Structure and method for fine pitch flip chip substrate
US6969674B2 · kind B2 · utility
8Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2004 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Sep 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a Fine Pitch flip chip substrate. A black oxide dam is made on the metal circuit between bump pads to replace the conventional solder resist so that the bump pads will not be buried in the solder resist. A small via is drilled by laser drilling and plated filled with copper to be used as the connection between the circuits. By this way, the density and the flexibility of routing could be improved. A mesh pattern can be made in the limited space to increase the stiffness of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.